dfm600fxm12 - a000 fast recovery diode module replaces ds5478 - 1.3 ds5478 - 2 april 2010 (ln267 59 ) 1 / 6 www.dynexsemi.com features ? low reverse recovery charge ? high switching speed ? low forward volt drop ? isolated alsic base with aln substrates ? dual diodes can be paralleled for 1200a rating ? lead free c onstruction applications ? chopper diodes ? boost and buck circuits ? free - wheel circuits ? multi - level switch inverters the df m 6 00fxm12 - a000 is a dual 12 00v, fast recovery diode (frd) module. designed for low power loss, the module is suitable for a variety of high voltage applications in motor drives and power conversion. fast swit ching times and low reverse recovery losses allow high frequency operation, making the device suitable for the latest drive designs employing pwm and high frequency switching. the module incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety . ordering information order as: df m 6 00fxm12 - a000 note: when ordering, please use the complete part number key parameters v rrm 12 00 v v f (typ) 1.9 v i f (max) 6 00 a i fm (max) 1 2 00 a external connection required for a single 1200a diode fig. 1 circuit configuration outline type code: f (see fig. 7 for further information) fig. 2 package 3(a) 4(a) 2(k) 1(k)
df m 600fxm12 - a000 2 /6 www.dynexsemi.com absolute maximum ratings stresses above those listed under absolute maximum ratings may cause permanent damage to the device. in extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. appropriate safety precautions shoul d always be followed. exposure to absolute maximum ratings may affect device reliability. t case = 25c unless stated otherwise symbol parameter test conditions max. units v rrm repeti tive peak reverse voltage t j = 125 c 1200 v i f forward current (per arm) dc, t case = 75 c , t j = 125c 6 00 a i fm max. forward current t case = 110 c , t p = 1ms 12 00 a i 2 t i 2 t value fuse current rating v r = 0, t p = 10ms, t j = 125c 10 0 ka 2 s p max max. transistor power dissipation t case = 25c, t j = 125 c 25 00 w v isol isolat ion voltage C per module commoned terminals to base plate. ac rms, 1 min, 50hz 2500 v q pd partial discharge C per module iec1287, v 1 = 13 00v, v 2 = 10 00v, 50hz rms 10 pc thermal and mechanical ratings internal insulation material: aln baseplate mater ial: alsic creepage distance: 20 mm clearance: 10 mm cti (comparative tracking index): 350 symbol parameter test conditions min typ. max units r th(j - c) thermal resistance (per arm ) continuous dissipation C th(c - h) t hermal resistance C j junction temperature - - 125 c t stg storage temperature range - 40 - 125 c screw torque mounting C C
df m 600fxm12 - a000 3 / 6 www.dynexsemi.com static electrical characteristics C per arm t case = 25 c unless stated otherwise. symbol parameter test conditions min typ max units i rm peak reverse current v r = 12 00v, t j = 125c 15 ma v f forward voltage i f = 6 00a 1.9 2.2 v i f = 6 00a, t j = 125c 2.1 2.4 v l m i nductance 20 nh static electrical characteristics t case = 25c unless stated otherwise. symbol parameter test conditions min typ max units l m module inductance (externally connected in parallel) 15 nh dynami c electrical characteristics C per arm t case = 25c unless stated otherwise symbol parameter test conditions min typ. max units q rr r everse recovery charge i f = 6 00a v r = 6 00v di f /dt = 45 00a/ s 100 c i rr peak r everse recovery current 400 a e rec r everse recovery energy 40 mj t case = 125c unless stated otherwise symbol parameter test conditions min typ. max units q rr reverse recovery charge i f = 6 00a v r = 6 00v di f /dt = 42 00a/s 150 c i rr peak r everse recovery current 475 a e rec reverse recovery energy 70 mj
df m 600fxm12 - a000 4 /6 www.dynexsemi.com fig. 3 diode typical forward characteristics fig. 4 transient thermal impedance fig. 5 dc current rating vs case temperature fig. 6 rbsoa
df m 600fxm12 - a000 5 / 6 www.dynexsemi.com package details for further package information, please visit our website or contact customer services. all dimensions in mm, unless stated otherwise. do not scale. nominal weight: 900g module outline type code: f fig. 7 module out line drawing 4 x m8 3 x m4 screwing depth max 16 screwing depth max 8 130 0.5 124 0.25 30 0.2 16 0.2 18.5 0.2 2.5 0.2 29.2 0.5 28 0.5 5.25 0.3 35 0.2 11 0.2 14.5 0.2 18 0.2 61.4 0.3 38 +1.5 -0.0 57 0.25 57 0.25 114 0.1 external connection external connection 1(c) 2(c) 3(a) 4(a) 6 x 7 140 0.5
df m 600fxm12 - a000 6 /6 www.dynexsemi.com headquarters operations customer service dynex semiconductor ltd doddington road, lincoln lincolnshire, ln6 3lf, united kingdom dynex semiconductor ltd doddington road, lincoln lincolnshire, ln6 3lf, united kingdom fax: +44(0)1522 500550 fax: +44(0)1522 500020 tel: +44(0)1522 500500 tel: +44(0)1522 502901 / 502753 email: power_solutions@dynexsemi.com ? dynex semiconductor technical documentation C not for resale . produced in united kingdom. datasheet annotations: dynex semiconductor annotate datasheets in the top right hand corner of the front page, to indicate product status. the annotations are as follows: - target information: this is the most tentative fo rm of information and represents a very preliminary specification. no actual work on the product has been started. preliminary information: the product is in design and development. the datasheet represents the product as it is understood but may chang e. advance information: the product design is complete and final characterisation for volume production is well in hand. no annotation: the product parameters are fixed and the product is available to datasheet specification. this publication is issued to provide information only which (unless agreed by the company in writing) may not be used, appli ed or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating t o the products or services concerned. no warranty or guarantee expressed or implied is made regarding the capability, perfor mance or suitability of any product or service. the company reserves the right to alter without prior notice the specification, de sign or price of any product or service. information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactor y in a specific piece of equipment. it is the users resp onsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. these products are not suitable for use in any medical product s whose failure to perform may result in significant injury or death to the user. all products and materials are sold and se rvices provided subject to the companys conditions of sale, which are available on request. all brand names and product names use d in this publication are trademarks, registered trademarks or trade names of their respective owners.
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